SoC (System On Chip) (4856)

Series:

Zynq®-7000

Architecture:

MCU, FPGA

Core Processor:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA

Connectivity:

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

667MHz

Primary Attributes:

Artix™-7 FPGA, 85K Logic Cells

Operating Temperature:

0°C ~ 85°C (TJ)

Package / Case:

400-LFBGA, CSPBGA

Supplier Device Package:

400-CSPBGA (17x17)

Series:

SmartFusion®2

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

256KB

RAM Size:

64KB

Peripherals:

DDR, PCIe, SERDES

Connectivity:

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed:

166MHz

Primary Attributes:

FPGA - 50K Logic Modules

Operating Temperature:

0°C ~ 85°C (TJ)

Package / Case:

896-BGA

Supplier Device Package:

896-FBGA (31x31)

Series:

SmartFusion®2

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

256KB

RAM Size:

64KB

Peripherals:

DDR, PCIe, SERDES

Connectivity:

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed:

166MHz

Primary Attributes:

FPGA - 50K Logic Modules

Operating Temperature:

0°C ~ 85°C (TJ)

Package / Case:

896-BGA

Supplier Device Package:

896-FBGA (31x31)

Series:

SmartFusion®

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

256KB

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Speed:

80MHz

Primary Attributes:

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

288-TFBGA, CSPBGA

Supplier Device Package:

288-CSP (11x11)

Series:

SmartFusion®

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

512KB

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Speed:

80MHz

Primary Attributes:

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

Operating Temperature:

0°C ~ 85°C (TJ)

Package / Case:

288-TFBGA, CSPBGA

Supplier Device Package:

288-CSP (11x11)

Series:

SmartFusion®

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

128KB

RAM Size:

16KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, I²C, SPI, UART/USART

Speed:

80MHz

Primary Attributes:

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

Operating Temperature:

0°C ~ 85°C (TJ)

Package / Case:

288-TFBGA, CSPBGA

Supplier Device Package:

288-CSP (11x11)

Series:

SmartFusion®

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

512KB

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Speed:

100MHz

Primary Attributes:

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

288-TFBGA, CSPBGA

Supplier Device Package:

288-CSP (11x11)

Series:

SmartFusion®

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

256KB

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Speed:

80MHz

Primary Attributes:

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

288-TFBGA, CSPBGA

Supplier Device Package:

288-CSP (11x11)

Series:

SmartFusion®

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

128KB

RAM Size:

16KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, I²C, SPI, UART/USART

Speed:

80MHz

Primary Attributes:

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

Operating Temperature:

0°C ~ 85°C (TJ)

Package / Case:

288-TFBGA, CSPBGA

Supplier Device Package:

288-CSP (11x11)

Series:

SmartFusion®

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

128KB

RAM Size:

16KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, I²C, SPI, UART/USART

Speed:

100MHz

Primary Attributes:

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

Operating Temperature:

0°C ~ 85°C (TJ)

Package / Case:

288-TFBGA, CSPBGA

Supplier Device Package:

288-CSP (11x11)