Part Number:
XCZU2EG-3SFVA625E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 625FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
625-BFBGA, FCBGA
Supplier Device Package:
625-FCBGA (21x21)
Stock:
313
Part Number:
XCZU2EG-3SBVA484E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 484FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19x19)
Stock:
470
Part Number:
M2S010S-TQ144I
Manufacturer:
Microsemi
Description:
IC SOC CORTEX-M3 166MHZ 144TQFP
Series:
SmartFusion®2
Architecture:
MCU, FPGA
Core Processor:
ARM® Cortex®-M3
Flash Size:
256KB
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:
166MHz
Primary Attributes:
FPGA - 10K Logic Modules
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20x20)
Stock:
257
Part Number:
M2S010S-TQ144
Manufacturer:
Microsemi
Description:
IC SOC CORTEX-M3 166MHZ 144TQFP
Series:
SmartFusion®2
Architecture:
MCU, FPGA
Core Processor:
ARM® Cortex®-M3
Flash Size:
256KB
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:
166MHz
Primary Attributes:
FPGA - 10K Logic Modules
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20x20)
Stock:
261
Part Number:
M2S010S-1TQ144I
Manufacturer:
Microsemi
Description:
IC SOC CORTEX-M3 166MHZ 144TQFP
Series:
SmartFusion®2
Architecture:
MCU, FPGA
Core Processor:
ARM® Cortex®-M3
Flash Size:
256KB
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:
166MHz
Primary Attributes:
FPGA - 10K Logic Modules
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20x20)
Stock:
210
Part Number:
M2S010S-1TQ144
Manufacturer:
Microsemi
Description:
IC SOC CORTEX-M3 166MHZ 144TQFP
Series:
SmartFusion®2
Architecture:
MCU, FPGA
Core Processor:
ARM® Cortex®-M3
Flash Size:
256KB
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed:
166MHz
Primary Attributes:
FPGA - 10K Logic Modules
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20x20)
Stock:
247
Part Number:
BCM3384ZCSD01
Manufacturer:
Broadcom
Description:
24X8 DOCSIS 3.0 MODEM
Series:
*
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
163
Part Number:
BCM3384GCSA01
Manufacturer:
Broadcom
Description:
24X8 DOCSIS 3.0 MODEM
Series:
*
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
257
Part Number:
BCM3384DSA01
Manufacturer:
Broadcom
Description:
24X8 DOCSIS 3.0 MODEM 3384D
Series:
*
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
405
Part Number:
BCM3384DCSA01
Manufacturer:
Broadcom
Description:
24X8 DOCSIS 3.0 MODEM 3384D
Series:
*
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
176
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