Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XCZU7EG-2FFVF1517I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1517FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40x40)
Stock:
301
Part Number:
XCZU7EG-3FBVB900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
139
Part Number:
XCZU7EG-3FFVC1156E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
256
Part Number:
XCZU7EG-3FFVF1517E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1517FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40x40)
Stock:
409
Part Number:
XCZU7EG-L1FBVB900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
431
Part Number:
XCZU7EG-L1FFVC1156I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
350
Part Number:
XCZU7EG-L1FFVF1517I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1517FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40x40)
Stock:
343
Part Number:
XCZU7EG-L2FBVB900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
485
Part Number:
XCZU7EG-L2FFVC1156E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
108
Part Number:
XCZU7EG-L2FFVF1517E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1517FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40x40)
Stock:
408
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