Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XCZU3EG-1SFVC784E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
294
Part Number:
XCZU3EG-1SFVC784I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
186
Part Number:
XCZU3EG-2SBVA484E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 484FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19x19)
Stock:
166
Part Number:
XCZU3EG-2SBVA484I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 484FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19x19)
Stock:
345
Part Number:
XCZU3EG-2SFVA625E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 625FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
625-BFBGA, FCBGA
Supplier Device Package:
625-FCBGA (21x21)
Stock:
396
Part Number:
XCZU3EG-2SFVA625I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 625FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
625-BFBGA, FCBGA
Supplier Device Package:
625-FCBGA (21x21)
Stock:
457
Part Number:
XCZU3EG-2SFVC784E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
241
Part Number:
XCZU3EG-2SFVC784I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
215
Part Number:
XCZU3EG-3SFVC784E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
428
Part Number:
XCZU3EG-L1SBVA484I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 484FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19x19)
Stock:
192
每日获取来自全球众多供应商的最新优惠资讯