Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XCZU15EG-1FFVB1156I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
197
Part Number:
XCZU15EG-1FFVC900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
124
Part Number:
XCZU15EG-1FFVC900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
333
Part Number:
XCZU15EG-2FFVB1156E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
250
Part Number:
XCZU15EG-2FFVB1156I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
249
Part Number:
XCZU15EG-2FFVC900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
471
Part Number:
XCZU15EG-2FFVC900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
393
Part Number:
XCZU15EG-3FFVB1156E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
152
Part Number:
XCZU15EG-3FFVC900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
109
Part Number:
XCZU15EG-L1FFVB1156I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
332
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