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Embedded Processors & Controllers (139284)

Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.

Records 139284
Page 13875/13929
TDA4VM88TGBALFQ1

Part Number:

TDA4VM88TGBALFQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

  • Flash Size:

    -

  • RAM Size:

    1.5MB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB

  • Speed:

    2GHz, 1GHz, 1.35GHz, 1GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    827-BFBGA, FCBGA

  • Supplier Device Package:

    827-FCBGA (24x24)

Stock:

0

1
TDA4VM88TGBALFR

Part Number:

TDA4VM88TGBALFR

Manufacturer:

Texas Instruments

Description:

NEXT GENERATION SOC FAMILY FOR L

  • Series:

    -

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

  • Flash Size:

    -

  • RAM Size:

    1.5MB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB

  • Speed:

    2GHz, 1GHz, 1.35GHz, 1GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 105°C (TJ)

  • Package / Case:

    827-BFBGA, FCBGA

  • Supplier Device Package:

    827-FCBGA (24x24)

Stock:

1485

1
TDA4VM88TGBALFRQ1

Part Number:

TDA4VM88TGBALFRQ1

Manufacturer:

Texas Instruments

Description:

NEXT GENERATION SOC FAMILY FOR L

  • Series:

    -

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

  • Flash Size:

    -

  • RAM Size:

    1.5MB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB

  • Speed:

    2GHz, 1GHz, 1.35GHz, 1GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    827-BFBGA, FCBGA

  • Supplier Device Package:

    827-FCBGA (24x24)

Stock:

699

1
TDA4VM88TRBALFQ1

Part Number:

TDA4VM88TRBALFQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

  • Flash Size:

    -

  • RAM Size:

    1.5MB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB

  • Speed:

    2GHz, 1GHz, 1.35GHz, 1GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    827-BFBGA, FCBGA

  • Supplier Device Package:

    827-FCBGA (24x24)

Stock:

0

1
TDA4VM88TRBALFRQ1

Part Number:

TDA4VM88TRBALFRQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

  • Flash Size:

    -

  • RAM Size:

    1.5MB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB

  • Speed:

    2GHz, 1GHz, 1.35GHz, 1GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    827-BFBGA, FCBGA

  • Supplier Device Package:

    827-FCBGA (24x24)

Stock:

0

1
WDC6202GJL250X

Part Number:

WDC6202GJL250X

Manufacturer:

Texas Instruments

Description:

WIRELESS 27MM 6202 WITH XBUS

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1
X5777AXGAAS

Part Number:

X5777AXGAAS

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1
XA7Z010-1CLG225I

Part Number:

XA7Z010-1CLG225I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX A-9 ZYNQ7 225BGA

  • Series:

    Automotive, AEC-Q100, Zynq?-7000 XA

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM? Cortex?-A9 MPCore? with CoreSight?

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Artix?-7 FPGA, 28K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    225-LFBGA, CSPBGA

  • Supplier Device Package:

    225-CSPBGA (13x13)

Stock:

6432

1
XA7Z010-1CLG225Q

Part Number:

XA7Z010-1CLG225Q

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 667MHZ 225BGA

  • Series:

    Automotive, AEC-Q100, Zynq®-7000 XA

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Artix™-7 FPGA, 28K Logic Cells

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    225-LFBGA, CSPBGA

  • Supplier Device Package:

    225-CSPBGA (13x13)

Stock:

449

1
XA7Z010-1CLG400I

Part Number:

XA7Z010-1CLG400I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 667MHZ 400BGA

  • Series:

    Automotive, AEC-Q100, Zynq®-7000 XA

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Artix™-7 FPGA, 28K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    400-LFBGA, CSPBGA

  • Supplier Device Package:

    400-CSPBGA (17x17)

Stock:

486

1

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