Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
TDA2MGBRQABCRQ1
Manufacturer:
Texas Instruments
Description:
PROTOTYPE
Series:
-
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
TDA2PHFUQACDQ1
Manufacturer:
Texas Instruments
Description:
HIGH PERFORMANCE SOC FAMILY W/ O
Series:
-
Architecture:
DSP, MPU
Core Processor:
ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size:
-
RAM Size:
2.5MB
Peripherals:
DMA, PWM, WDT
Connectivity:
CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed:
1.176GHz, 1GHz
Primary Attributes:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
784-LFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
0
Part Number:
TDA2PHFUQACDRQ1
Manufacturer:
Texas Instruments
Description:
PROTOTYPE
Series:
-
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
TDA2PHGRCQACDQ1
Manufacturer:
Texas Instruments
Description:
HIGH PERFORMANCE SOC FAMILY W/ O
Series:
-
Architecture:
DSP, MPU
Core Processor:
ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size:
-
RAM Size:
2.5MB
Peripherals:
DMA, PWM, WDT
Connectivity:
CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed:
750MHz, 750MHz
Primary Attributes:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
784-LFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
0
Part Number:
TDA2PHGRCQACDRQ1
Manufacturer:
Texas Instruments
Description:
HIGH PERFORMANCE SOC FAMILY W/ O
Series:
-
Architecture:
DSP, MPU
Core Processor:
ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size:
-
RAM Size:
2.5MB
Peripherals:
DMA, PWM, WDT
Connectivity:
CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed:
750MHz, 750MHz
Primary Attributes:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
784-LFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
0
Part Number:
TDA2PHGRQACDQ1
Manufacturer:
Texas Instruments
Description:
PROTOTYPE
Series:
-
Architecture:
DSP, MPU
Core Processor:
ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size:
-
RAM Size:
2.5MB
Peripherals:
DMA, PWM, WDT
Connectivity:
CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed:
750MHz, 750MHz
Primary Attributes:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
784-LFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
0
Part Number:
TDA2PHGRQACDRQ1
Manufacturer:
Texas Instruments
Description:
HIGH PERFORMANCE SOC FAMILY W/ O
Series:
-
Architecture:
DSP, MPU
Core Processor:
ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size:
-
RAM Size:
2.5MB
Peripherals:
DMA, PWM, WDT
Connectivity:
CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed:
750MHz, 750MHz
Primary Attributes:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
784-LFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
0
Part Number:
TDA2PHVDQACDQ1
Manufacturer:
Texas Instruments
Description:
HIGH PERFORMANCE SOC FAMILY W/ O
Series:
-
Architecture:
DSP, MPU
Core Processor:
ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size:
-
RAM Size:
2.5MB
Peripherals:
DMA, PWM, WDT
Connectivity:
CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed:
500MHz, 500MHz
Primary Attributes:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
784-LFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
0
Part Number:
TDA2PHVDQACDRQ1
Manufacturer:
Texas Instruments
Description:
HIGH PERFORMANCE SOC FAMILY W/ O
Series:
-
Architecture:
DSP, MPU
Core Processor:
ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x
Flash Size:
-
RAM Size:
2.5MB
Peripherals:
DMA, PWM, WDT
Connectivity:
CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB
Speed:
500MHz, 500MHz
Primary Attributes:
-
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
784-LFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
0
Part Number:
TDA2PHVRL1ACDRQ1
Manufacturer:
Texas Instruments
Description:
PROTOTYPE
Series:
-
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
0
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