Part Number:
TE0820-05-2BE81ML
Manufacturer:
Trenz Electronic GmbH
Description:
MPSOC MODULE WITH XILINX ZYNQ UL
Series:
-
Module/Board Type:
-
Core Processor:
-
Co-Processor:
-
Speed:
-
Flash Size:
-
RAM Size:
-
Connector Type:
-
Size / Dimension:
-
Operating Temperature:
-
Stock:
0
Part Number:
6231-HX-XXA-RC
Manufacturer:
Critical Link LLC
Description:
SOM WITH TI SITARA AM6231, 800MH
Series:
MitySOM-AM62
Module/Board Type:
MPU Core
Core Processor:
ARM® Cortex®-A53
Co-Processor:
NEON SIMD
Speed:
800MHz
Flash Size:
-
RAM Size:
1GB
Connector Type:
SO-DIMM-260
Size / Dimension:
2.740" L x 1.500" W (69.60mm x 38.10mm)
Operating Temperature:
0°C ~ 70°C
Stock:
0
Part Number:
A10S-P9-A5E-RC-SB
Manufacturer:
Critical Link LLC
Description:
ARRIA 10 SOC MODULE, 480KLE, 6GB
Series:
MitySOM
Module/Board Type:
MPU, FPGA Core
Core Processor:
ARM® Cortex®-A9
Co-Processor:
NEON™ SIMD
Speed:
1.2GHz
Flash Size:
-
RAM Size:
4GB
Connector Type:
Board-to-Board (BTB)
Size / Dimension:
4.000" L x 4.000" W (101.50mm x 101.50mm)
Operating Temperature:
0°C ~ 70°C
Stock:
0
Part Number:
XP100200S-05R-J
Manufacturer:
Lantronix, Inc.
Description:
XPORT, EXTENDED TEMPERATURE, ENC
Series:
XPort®
Module/Board Type:
-
Core Processor:
DSTni-EX
Co-Processor:
XPort AR
Speed:
25MHz
Flash Size:
512KB
RAM Size:
256KB
Connector Type:
RJ-45
Size / Dimension:
1.330" L x 0.640" W (33.90mm x 16.25mm)
Operating Temperature:
-40°C ~ 85°C
Stock:
0
Part Number:
TE0807-03-5AI21-A
Manufacturer:
Trenz Electronic GmbH
Description:
MPSOC ZYNQ USCALE 4GB DDR4
Series:
-
Module/Board Type:
-
Core Processor:
-
Co-Processor:
-
Speed:
-
Flash Size:
-
RAM Size:
-
Connector Type:
-
Size / Dimension:
-
Operating Temperature:
-
Stock:
0
Part Number:
TE0630-02-52C12-A
Manufacturer:
Trenz Electronic GmbH
Description:
FPGA MODULE SPARTAN-6
Series:
-
Module/Board Type:
-
Core Processor:
-
Co-Processor:
-
Speed:
-
Flash Size:
-
RAM Size:
-
Connector Type:
-
Size / Dimension:
-
Operating Temperature:
-
Stock:
0
Part Number:
TEM0005-02-010I
Manufacturer:
Trenz Electronic GmbH
Description:
FPGA MODULE WITH MICROCHIP SMART
Series:
SmartFusion®
Module/Board Type:
FPGA
Core Processor:
-
Co-Processor:
-
Speed:
-
Flash Size:
32MB QSPI
RAM Size:
256MB
Connector Type:
B2B
Size / Dimension:
2.205" L x 1.220" W (56.00mm x 31.00mm)
Operating Temperature:
-
Stock:
0
Part Number:
TE0807-03-7DI21-AZ
Manufacturer:
Trenz Electronic GmbH
Description:
MPSOC MODULE WITH AMD ZYNQ ULTRA
Series:
Zynq UltraScale+
Module/Board Type:
MPU Core
Core Processor:
Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900I
Co-Processor:
-
Speed:
-
Flash Size:
128MB
RAM Size:
4GB
Connector Type:
Board-to-Board (BTB) Socket - 4 x 160
Size / Dimension:
2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature:
-40°C ~ 85°C
Stock:
0
Part Number:
TE0818-02-BBE81-A
Manufacturer:
Trenz Electronic GmbH
Description:
ULTRASOM+ MPSOC MODULE WITH AMD
Series:
Zynq UltraScale+
Module/Board Type:
MPU Core
Core Processor:
Xilinx Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor:
-
Speed:
-
Flash Size:
128MB
RAM Size:
4GB
Connector Type:
Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension:
2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature:
0°C ~ 85°C
Stock:
0
Part Number:
TE0808-04-06EG-1EK
Manufacturer:
Trenz Electronic GmbH
Description:
IC MOD SOM MPSOC
Series:
TE0808
Module/Board Type:
MPU Core
Core Processor:
Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor:
-
Speed:
-
Flash Size:
128MB
RAM Size:
4GB
Connector Type:
B2B
Size / Dimension:
2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature:
0°C ~ 85°C
Stock:
0
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