Part Number:
TE0807-02-4BE21-A
Manufacturer:
Trenz Electronic GmbH
Description:
IC MODULE ZYNQ USCALE
Series:
-
Module/Board Type:
-
Core Processor:
-
Co-Processor:
-
Speed:
-
Flash Size:
-
RAM Size:
-
Connector Type:
-
Size / Dimension:
-
Operating Temperature:
-
Stock:
0
Part Number:
TE0813-01-5DI21-A
Manufacturer:
Trenz Electronic GmbH
Description:
MPSOC MODULE WITH XILINX ZYNQ UL
Series:
Zynq® UltraScale+™
Module/Board Type:
MPU Core
Core Processor:
Zynq UltraScale+ XCZU5EV-1SFVC784I
Co-Processor:
-
Speed:
-
Flash Size:
128MB
RAM Size:
4GB
Connector Type:
Board-to-Board (BTB) Socket - 240
Size / Dimension:
2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature:
-40°C ~ 85°C
Stock:
0
Part Number:
TE0720-03-61C530A
Manufacturer:
Trenz Electronic GmbH
Description:
IC SOC MODULE XILINX ZYNQ
Series:
TE0720
Module/Board Type:
MCU, FPGA
Core Processor:
ARM Cortex-A9
Co-Processor:
Zynq-7000 (Z-7020)
Speed:
125MHz
Flash Size:
-
RAM Size:
256MB
Connector Type:
Samtec LSHM
Size / Dimension:
1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature:
0°C ~ 70°C
Stock:
0
Part Number:
TE0803-04-2AE11-A
Manufacturer:
Trenz Electronic GmbH
Description:
IC MODULE ZYNQ USCALE 2GB 128MB
Series:
TE0803
Module/Board Type:
MPU Core
Core Processor:
Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor:
-
Speed:
-
Flash Size:
128MB
RAM Size:
2GB
Connector Type:
B2B
Size / Dimension:
2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature:
0°C ~ 85°C
Stock:
0
Part Number:
OSD32MP157C-512M-IAA
Manufacturer:
Octavo Systems LLC
Description:
SIP ARM CORTEX STM32MP157C
Series:
OSD32MP15x
Module/Board Type:
MPU Core
Core Processor:
Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor:
NEON™ SIMD
Speed:
650MHz, 209MHz
Flash Size:
-
RAM Size:
-
Connector Type:
302-BGA
Size / Dimension:
0.709" L x 0.709" W (18.00mm x 18.00mm)
Operating Temperature:
-40°C ~ 85°C
Stock:
1929
Part Number:
TEM0007-01-CAD11-A
Manufacturer:
Trenz Electronic GmbH
Description:
MICROCHIP POLARFIRE SOC FPGA 25T
Series:
PolarFire®
Module/Board Type:
FPGA
Core Processor:
-
Co-Processor:
-
Speed:
-
Flash Size:
64MB
RAM Size:
1GB
Connector Type:
B2B
Size / Dimension:
1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature:
-
Stock:
0
Part Number:
TEM0007-01-CHE11-A
Manufacturer:
Trenz Electronic GmbH
Description:
MICROCHIP POLARFIRE SOC FPGA 250
Series:
PolarFire®
Module/Board Type:
FPGA
Core Processor:
-
Co-Processor:
-
Speed:
-
Flash Size:
64MB
RAM Size:
1GB
Connector Type:
B2B
Size / Dimension:
1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature:
-
Stock:
0
Part Number:
A20-SOM-N8GB
Manufacturer:
Olimex LTD
Description:
IC
Series:
-
Module/Board Type:
MPU Core
Core Processor:
ARM® Cortex®-A7
Co-Processor:
-
Speed:
1GHz
Flash Size:
8GB
RAM Size:
1GB
Connector Type:
40 Pin
Size / Dimension:
3.200" L x 2.200" W (81.28mm x 55.88mm)
Operating Temperature:
0°C ~ 70°C
Stock:
0
Part Number:
TE0715-04-21C33-A
Manufacturer:
Trenz Electronic GmbH
Description:
IC SOC MODULE 1GB DDR3L
Series:
TE0715
Module/Board Type:
MCU, FPGA
Core Processor:
ARM Cortex-A9
Co-Processor:
Zynq-7000 (Z-7012S)
Speed:
125MHz
Flash Size:
32MB
RAM Size:
1GB
Connector Type:
Samtec LSHM
Size / Dimension:
1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature:
0°C ~ 70°C
Stock:
0
Part Number:
TE0808-04-09EG-1EL
Manufacturer:
Trenz Electronic GmbH
Description:
IC MOD SOM MPSOC
Series:
TE0808
Module/Board Type:
MPU Core
Core Processor:
Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor:
-
Speed:
-
Flash Size:
128MB
RAM Size:
4GB
Connector Type:
B2B
Size / Dimension:
2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature:
0°C ~ 85°C
Stock:
0
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