Part Number:
10M50DCF672I6G
Manufacturer:
Intel
Description:
IC FPGA 500 I/O 672FBGA
Series:
MAX® 10
Number of LABs/CLBs:
3125
Number of Logic Elements/Cells:
50000
Total RAM Bits:
1677312
Number of I/O:
500
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27x27)
Stock:
130
Part Number:
10M50DCF256I6G
Manufacturer:
Intel
Description:
IC FPGA 178 I/O 256FBGA
Series:
MAX® 10
Number of LABs/CLBs:
3125
Number of Logic Elements/Cells:
50000
Total RAM Bits:
1677312
Number of I/O:
178
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FBGA (17x17)
Stock:
413
Part Number:
10M50DAF672I6G
Manufacturer:
Intel
Description:
IC FPGA 500 I/O 672FBGA
Series:
MAX® 10
Number of LABs/CLBs:
3125
Number of Logic Elements/Cells:
50000
Total RAM Bits:
1677312
Number of I/O:
500
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27x27)
Stock:
444
Part Number:
10M50DAF484I6G
Manufacturer:
Intel
Description:
IC FPGA 360 I/O 484FBGA
Series:
MAX® 10
Number of LABs/CLBs:
3125
Number of Logic Elements/Cells:
50000
Total RAM Bits:
1677312
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23x23)
Stock:
168
Part Number:
10M50DAF256I6G
Manufacturer:
Intel
Description:
IC FPGA 178 I/O 256FBGA
Series:
MAX® 10
Number of LABs/CLBs:
3125
Number of Logic Elements/Cells:
50000
Total RAM Bits:
1677312
Number of I/O:
178
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FBGA (17x17)
Stock:
308
Part Number:
10M40DCF672I6G
Manufacturer:
Intel
Description:
IC FPGA 500 I/O 672FBGA
Series:
MAX® 10
Number of LABs/CLBs:
2500
Number of Logic Elements/Cells:
40000
Total RAM Bits:
1290240
Number of I/O:
500
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27x27)
Stock:
315
Part Number:
10M40DCF484I6G
Manufacturer:
Intel
Description:
IC FPGA 360 I/O 484FBGA
Series:
MAX® 10
Number of LABs/CLBs:
2500
Number of Logic Elements/Cells:
40000
Total RAM Bits:
1290240
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23x23)
Stock:
136
Part Number:
10M40DCF256I6G
Manufacturer:
Intel
Description:
IC FPGA 178 I/O 256FBGA
Series:
MAX® 10
Number of LABs/CLBs:
2500
Number of Logic Elements/Cells:
40000
Total RAM Bits:
1290240
Number of I/O:
178
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FBGA (17x17)
Stock:
225
Part Number:
10M40DAF672I6G
Manufacturer:
Intel
Description:
IC FPGA 500 I/O 672FBGA
Series:
MAX® 10
Number of LABs/CLBs:
2500
Number of Logic Elements/Cells:
40000
Total RAM Bits:
1290240
Number of I/O:
500
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BGA
Supplier Device Package:
672-FBGA (27x27)
Stock:
219
Part Number:
10M40DAF484I6G
Manufacturer:
Intel
Description:
IC FPGA 360 I/O 484FBGA
Series:
MAX® 10
Number of LABs/CLBs:
2500
Number of Logic Elements/Cells:
40000
Total RAM Bits:
1290240
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23x23)
Stock:
140
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