图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
---|---|---|---|---|---|---|
NXP |
MOSFET RF 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存3,584 |
|
||
NXP |
IC LED DRVR LIN DIM 25MA 20TSSOP
|
封装: 20-TSSOP (0.173", 4.40mm Width) |
库存4,752 |
|
||
NXP |
IC TXRX 4BIT TRANSLATNG 16XQFN
|
封装: - |
库存5,408 |
|
||
NXP |
IC LATCH OCTAL D 3STATE 20DIP
|
封装: 20-DIP (0.300", 7.62mm) |
库存4,096 |
|
||
NXP |
IC C2K 1.2GHZ 8CH VOIP 625BGA
|
封装: - |
库存4,672 |
|
||
NXP |
IC MPU MPC85XX 1.2GHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存6,736 |
|
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
封装: 689-BBGA Exposed Pad |
库存3,888 |
|
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
封装: 256-BBGA |
库存5,584 |
|
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
封装: - |
库存5,632 |
|
||
NXP |
IC OCTUPLE 6BIT DAC 20SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存6,592 |
|
||
NXP |
IC CLK BUF CISC 80MHZ 1CIRC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存8,724 |
|
||
NXP |
RF EVAL FOR BGU7005
|
封装: - |
库存5,724 |
|
||
NXP |
IC FM-IF AMP/DEMOD CIRC 20SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存4,986 |
|
||
NXP |
TRANS HBP 20.5DBM 15DB SOT-89
|
封装: TO-243AA |
库存8,388 |
|
||
NXP |
FS6500
|
封装: 48-LQFP Exposed Pad |
库存5,632 |
|
||
NXP |
16-BIT I2C-BUS AND SMBUS LOW POW
|
封装: 24-TSSOP (0.173", 4.40mm Width) |
库存2,496 |
|
||
NXP |
IC HD RADIO PROCESSOR 144HLQFP
|
封装: 144-LQFP Exposed Pad |
库存4,592 |
|
||
NXP |
QORIQ 2XCPU 64-BIT ARM ARCH 1.
|
封装: - |
库存7,200 |
|
||
NXP |
I.MX 6DL ROM PERF ENHAN
|
封装: 624-LFBGA |
库存4,288 |
|
||
NXP |
QORIQ LAYERSCAPE 4XA72 64BIT ARM
|
封装: - |
库存6,592 |
|
||
NXP |
NXP 32-BIT MCU DUAL POWER ARCH
|
封装: 256-LBGA |
库存4,960 |
|
||
NXP |
DUAL CORE 3M FLASH 384K RAM F
|
封装: 176-LQFP Exposed Pad |
库存5,952 |
|
||
NXP |
16-BIT MCU S12X CORE 384KB FLA
|
封装: 80-QFP |
库存2,336 |
|
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 100-LQFP |
库存4,768 |
|
||
NXP |
16-BIT MCU S12 CORE 128KB FLAS
|
封装: 48-LQFP |
库存5,584 |
|
||
NXP |
IC MCU 8BIT 8KB FLASH 28SOIC
|
封装: 28-SOIC (0.295", 7.50mm Width) |
库存6,960 |
|
||
NXP |
IC MCU 32BIT 1MB FLASH 100MAPBGA
|
封装: - |
Request a Quote |
|
||
NXP |
POWER MANAGEMENT IC, PRE-PROG, 4
|
封装: - |
Request a Quote |
|
||
NXP |
CAR DSP
|
封装: - |
Request a Quote |
|
||
NXP |
S32R29 MULTICORE POWER ARCHITECT
|
封装: - |
Request a Quote |
|