NXP 产品

BUK7C1R4-40EJ

NXP

MOSFET N-CH 40V 200A D2PAK-7

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 40V
• Current - Continuous Drain (Id) @ 25°C: -
• Drive Voltage (Max Rds On, Min Rds On): -
• Vgs(th) (Max) @ Id: -
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Vgs (Max): -
• FET Feature: -
• Power Dissipation (Max): -
• Rds On (Max) @ Id, Vgs: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK (7-Lead)
• Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

封装: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

PZM6.2NB,115

NXP

DIODE ZENER 6.2V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 6.2V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

封装: TO-236-3, SC-59, SOT-23-3

LD6836CX4/27P,315

NXP

IC REG LINEAR 2.7V 300MA 4WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.7V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.16V @ 300mA
• Current - Output: 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

封装: 4-XFBGA, WLCSP

NE57814DD,518

NXP

IC DDR TERM W/STANDBY 8-SOIC

• Applications: Memory, DDR/DDR2 Regulator
• Current - Supply: 14mA
• Voltage - Supply: 1.6 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
• Supplier Device Package: 8-HSO

封装: 8-SOIC (0.154", 3.90mm Width) Exposed Pad

MC34933EP

NXP

IC MOTOR DRIVER PAR 16UQFN

• Motor Type - Stepper: Bipolar
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (4)
• Interface: Parallel
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: 1A
• Voltage - Supply: 2.7 V ~ 5.5 V
• Voltage - Load: 2 V ~ 7 V
• Operating Temperature: -20°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 16-UFQFN Exposed Pad
• Supplier Device Package: 16-UQFN-EP (3x3)

封装: 16-UFQFN Exposed Pad

N74F280BD,623

NXP

IC 9-BIT GEN/CHKER 14SO

• Logic Type: Parity Generator/Checker
• Number of Circuits: 9-Bit
• Current - Output High, Low: 1mA, 20mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

封装: 14-SOIC (0.154", 3.90mm Width)

74LVCH32245AEC,557

NXP

IC TRANSCVR TRI-ST 32BIT 96BGA

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

封装: 96-LFBGA

BGY687,112

NXP

IC PUSH-PULL AMP 600MHZ SOT115J

• Applications: CATV
• Output Type: Push-Pull
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 240mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: -
• Package / Case: SOT-115J
• Supplier Device Package: SOT115J

封装: SOT-115J

SA58672TK,138

NXP

IC AMP AUDIO 3W MONO D 10HVSON

• Type: Class D
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 3W x 1 @ 4 Ohm
• Voltage - Supply: 2 V ~ 5.5 V
• Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 10-HVSON (3x3)
• Package / Case: 10-VFDFN Exposed Pad

封装: 10-VFDFN Exposed Pad

TDA19977BHV/15/C1,

NXP

IC HDMI INTERFACE 144HLQFP

• Applications: HDTV
• Interface: HDMI
• Voltage - Supply: 1.8V, 3.3V
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-HLQFP (20x20)
• Mounting Type: Surface Mount

封装: 144-LQFP Exposed Pad

MPC8360CZUAJDGA

NXP

IC MPU MPC83XX 533MHZ 740TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 740-LBGA
• Supplier Device Package: 740-TBGA (37.5x37.5)

封装: 740-LBGA

KMPC8270ZUUPEA

NXP

IC MPU MPC82XX 450MHZ 408TBGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 450MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

封装: 480-LBGA

MPC860SRZQ80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

MPC852TZT80A

NXP

IC MPU MPC8XX 80MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

封装: 256-BBGA

MC9S08SV8CLC

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 30
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

SP5746CHK0AMMJ6R

NXP

32 BIT DUAL CORE 3M FLASH 512K R

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MC9S12C96CFUE

NXP

IC MCU 16BIT 96KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 60
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

封装: 80-QFP

MCF52255CAF80

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, Ethernet, I2C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

LPC54101J256UK49Z

NXP

IC MCU 32BIT 256KB FLASH 49WLCSP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 104K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 49-UFBGA, WLCSP
• Supplier Device Package: 49-WLCSP (3.29x3.29)

封装: 49-UFBGA, WLCSP

LPC2146FBD64,151

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 45
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 40K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 14x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

MSC8101M1500F

NXP

DSP 16BIT 300MHZ CPM 332FCBGA

• Type: SC140 Core
• Interface: Communications Processor Module (CPM)
• Clock Rate: 300MHz
• Non-Volatile Memory: External
• On-Chip RAM: 512kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.60V
• Operating Temperature: -40°C ~ 75°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 332-BFBGA, FCPBGA
• Supplier Device Package: 332-FCBGA (17x17)

封装: 332-BFBGA, FCPBGA

SA56004GD,118

NXP

SENSOR TEMPERATURE I2C/SMBUS 8SO

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: -40°C ~ 125°C
• Sensing Temperature - Remote: -40°C ~ 125°C
• Output Type: I2C/SMBus
• Voltage - Supply: 3 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封装: 8-SOIC (0.154", 3.90mm Width)

MPX5010DP

NXP

SENSOR DIFF PRESS 1.45 PSI MAX

• Pressure Type: Differential
• Operating Pressure: 1.45 PSI (10 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.19" (4.93mm) Tube, Dual
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 5.8 PSI (40 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP Module
• Supplier Device Package: -

封装: 6-SIP Module

MP3V5004DP

NXP

IC PRESSURE SENSOR 8-SOP

• Pressure Type: Differential
• Operating Pressure: 0.57 PSI (3.92 kPa)
• Output Type: Analog Voltage
• Output: 0.6 V ~ 3 V
• Accuracy: ±2.5%
• Voltage - Supply: 2.7 V ~ 3.3 V
• Port Size: Male - 0.13" (3.3mm) Tube, Dual
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 2.32 PSI (16 kPa)
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
• Supplier Device Package: -

封装: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side

SL2FCS1001DV/DH,11

NXP

IC I.CODE EPC FPC

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

CLRD852,599

NXP

CARD READER MIFARE

• RF Type: -
• Frequency: -
• Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MC33696FJAER2

NXP

IC RF TXRX ISM<1GHZ 32-VFQFN

• Type: TxRx Only
• RF Family/Standard: General ISM < 1GHz
• Protocol: -
• Modulation: FSK, OOK
• Frequency: 290MHz ~ 340MHz, 424MHz ~ 510MHz, 862MHz ~ 1.02GHz
• Data Rate (Max): 22.6kbps
• Power - Output: 7.25dBm
• Sensitivity: -106.5dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: -
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 10.3mA ~ 24mA
• Current - Transmitting: 6.1mA ~ 13.5mA
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad

封装: 32-VFQFN Exposed Pad

BGU8051X

NXP

IC AMP LNA 5V 900MHZ 8HWSON

• Frequency: 300MHz ~ 1.5GHz
• P1dB: 19dBm
• Gain: 18.3dB
• Noise Figure: 0.43dB
• RF Type: GSM, LTE, W-CDMA
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 48mA
• Test Frequency: 900MHz
• Package / Case: 8-WFDFN Exposed Pad
• Supplier Device Package: 8-HWSON (2x2)

封装: 8-WFDFN Exposed Pad

LPC865M201JHI33-0K

NXP

IC MCU 32BIT 64KB FLASH 32VFQFN

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: I2C, I3C, SMBus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 29
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 12x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

封装: -

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MIMXRT117TDVMAA

NXP

IC MCU 32BIT EXT MEM 289LFBGA

• Core Processor: ARM® Cortex®-M4, Cortex®-M7
• Core Size: 32-Bit Dual-Core
• Speed: 400MHz, 1GHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
• Number of I/O: 13
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 2M x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 95°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

封装: -

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