图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC MTSI-XL SWITCHING MQFP100
|
封装: 100-BQFP |
库存7,504 |
|
PCM, PLL | 1 | 3.13 V ~ 3.47 V | 200mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | P-MQFP-100 |
||
ON Semiconductor |
IC AUDIO DGTL TELECOM ASSP QFP
|
封装: - |
库存15,960 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC DGTL TELEPHONE CIRCUIT 28SOIC
|
封装: 28-SOIC (0.295", 7.50mm Width) |
库存5,328 |
|
- | 1 | 4.75 V ~ 5.25 V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Texas Instruments |
IC INTERFACE ISDN DEVICE 20-PLCC
|
封装: 20-LCC (J-Lead) |
库存5,808 |
|
ISDN | 1 | 4.75 ~ 5.25 V | - | - | - | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Inphi Corporation |
IC OPT TRANSPORT PROC 868-TBGA
|
封装: 868-BGA |
库存7,616 |
|
4-Bit Nibble, SFI-4.1, XSBI | - | - | - | - | - | Surface Mount | 868-BGA | 868-BGA |
||
Exar Corporation |
IC FSK DEMOD/TONE DECOD 14SOIC
|
封装: 14-SOIC (0.154", 3.90mm Width) |
库存90,000 |
|
- | - | 4.5 V ~ 20 V | 5mA | 900mW | 0°C ~ 70°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II SNGL 100LBGA
|
封装: 100-LBGA |
库存3,280 |
|
LVTTL | - | 3.135 V ~ 3.465 V | 390mA | - | -40°C ~ 85°C | Surface Mount | 100-LBGA | 100-TBGA (11x11) |
||
Maxim Integrated |
IC LIU T3/E3/STS-1 IND 48LQFP
|
封装: 48-LQFP |
库存4,896 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-TQFP (7x7) |
||
Maxim Integrated |
IC TRANSCEIVER T1 44-PLCC
|
封装: 44-LCC (J-Lead) |
库存18,264 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Maxim Integrated |
IC RECEIVE LINE INTERFACE 18-DIP
|
封装: 18-DIP (0.300", 7.62mm) |
库存5,056 |
|
T1 | 1 | 4.75 V ~ 5.25 V | 18mA | - | 0°C ~ 70°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Microsemi Corporation |
IC TDM SWITCH 1K-CH ENH 256BGA
|
封装: 256-BGA |
库存6,160 |
|
- | 1 | 1.71 V ~ 1.89 V | 115mA | - | -45°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Exar Corporation |
IC LIU/FRAMER T1/E1/J1 2CH 225BG
|
封装: 225-BGA |
库存3,408 |
|
- | - | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 QUAD SHORT 160-BGA
|
封装: 160-BGA |
库存7,824 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 160-BGA | 160-PBGA (15x15) |
||
Microsemi Corporation |
IC SLAC 4CH GCI/PCM 4IO 80LQFP
|
封装: 80-LQFP |
库存58,608 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-LQFP (12x12) |
||
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32QFN
|
封装: 32-VQFN Exposed Pad |
库存15,408 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
Microsemi Corporation |
IC SLIC 1CH 40DB LGBAL 32QFN
|
封装: 32-VQFN Exposed Pad |
库存18,072 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (8x8) |
||
IXYS Integrated Circuits Division |
DAA LITELINK III RING DETECT
|
封装: - |
库存6,432 |
|
- | - | - | - | - | - | - | - | - |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
封装: 28-SOIC (0.295", 7.50mm Width) |
库存2,336 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Silicon Labs |
IC PROSLIC SGL FXS ANLG 48-QFN
|
封装: 48-VFQFN Exposed Pad |
库存7,072 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Corporation |
IC TXRX DTMF 3V 24SSOP
|
封装: 24-SSOP (0.209", 5.30mm Width) |
库存7,200 |
|
- | 1 | 2.7 V ~ 3.6 V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
NXP |
CABLE FULL SPECTRUM TRANSCEIVER
|
封装: - |
库存4,832 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
TRAFFIC MGR PACKETPROC ASIC
|
封装: - |
库存4,752 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
VS9802:7% OH 100G CI-BCH-3
|
封装: - |
库存3,936 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
ARROW-2X192
|
封装: 1292-BGA, FCBGA |
库存6,560 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
||
Microchip Technology |
10GBE DUAL XFI TO XAUI XCVR W/ED
|
封装: - |
库存2,640 |
|
- | - | - | - | - | - | - | - | - |
||
Silicon Labs |
WIDEBAND FXS WITH ISI INTERFACE
|
封装: 38-QFN |
库存5,616 |
|
3-Wire | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 38-QFN | 38-QFN (4x6) |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 20SSOP
|
封装: 20-SSOP (0.209", 5.30mm Width) |
库存2,016 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA
|
封装: 552-BGA |
库存5,296 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256BGA
|
封装: 256-BGA |
库存5,088 |
|
- | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DNIC 24SSOP
|
封装: - |
库存3,104 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 24-SSOP |