图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC LIU E1/T1/J1 160LBGA
|
封装: 160-LBGA |
库存2,864 |
|
E1, J1, T1 | 4 | 1.8V, 3.3V | 230mA | 140mW | -40°C ~ 85°C | Surface Mount | 160-LBGA | P-LBGA-160 |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 20SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存3,952 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
封装: - |
库存4,720 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Maxim Integrated |
IC BBU POWER 20-TSSOP
|
封装: 20-TSSOP (0.173", 4.40mm Width) |
库存5,184 |
|
- | - | - | - | - | - | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38TSSOP
|
封装: 38-TFSOP (0.173", 4.40mm Width) |
库存15,276 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28SOIC
|
封装: 28-SOIC (0.295", 7.50mm Width) |
库存6,000 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
IXYS Integrated Circuits Division |
IC TONE DETECTOR PREC 20-SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存5,552 |
|
- | 1 | 2.7 V ~ 5.5 V | 15mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IXYS Integrated Circuits Division |
IC MOD DAA FULLWAVE CID/LOOP PCB
|
封装: 18-DIP Module (0.850", 21.59mm), 11 Leads |
库存6,496 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
IXYS Integrated Circuits Division |
IC MOD DAA HALFWAVE CID/LOOP PCB
|
封装: 18-DIP Module (0.850", 21.59mm), 11 Leads |
库存3,024 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Maxim Integrated |
IC TXRX T1/E1 QUAD 3.3V 256-BGA
|
封装: 256-BGA |
库存15,456 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Maxim Integrated |
IC CONTROLLER T1 5V 40-DIP
|
封装: 40-DIP (0.600", 15.24mm) |
库存3,280 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Maxim Integrated |
IC CONTROLLER T1 5V 44-PLCC
|
封装: 44-LCC (J-Lead) |
库存5,952 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 24K CH 484BGA
|
封装: 484-BGA |
库存7,920 |
|
- | 1 | 1.71 V ~ 1.89 V | 500mA | - | -40°C ~ 85°C | Surface Mount | 484-BGA | 484-PBGA (23x23) |
||
Microsemi Corporation |
IC DIGITAL SWITCH 8K CH 196BGA
|
封装: 256-BGA |
库存2,240 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 144-ELQFP
|
封装: 144-LQFP Exposed Pad |
库存2,608 |
|
LIU | 8 | 3.135 V ~ 3.465 V | 250mA | - | 0°C ~ 70°C | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
IXYS Integrated Circuits Division |
IC LINE CARD ACCESS SW 28-DFN
|
封装: 28-VDFN Exposed Pad |
库存3,040 |
|
- | 1 | 4.5 V ~ 5.5 V | 2mA | 10.5mW | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
IXYS Integrated Circuits Division |
IC RELAY OPTO 120MA 8DIP
|
封装: 8-DIP (0.300", 7.62mm) |
库存6,432 |
|
- | 2 | - | - | 800mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Silicon Labs |
IC SLIC LINE SUBSCRIBER 16SOIC
|
封装: 16-SOIC (0.154", 3.90mm Width) |
库存7,104 |
|
- | 1 | 3.13 V ~ 3.47 V | 25mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microsemi Solutions Sdn Bhd. |
11.5G GBPS QUAD REDRIVER WITH CR
|
封装: - |
库存10,716 |
|
- | 2 | 2.5V | - | - | - | Surface Mount | - | 32-QFN (5x5) |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
封装: 20-DIP (0.300", 7.62mm) |
库存5,536 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microsemi Corporation |
TEMAP 168, LF BUMP
|
封装: - |
库存6,208 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
封装: - |
库存4,816 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
SWITCH
|
封装: - |
库存5,040 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
48FE+4FE+HIGIG SWITCH
|
封装: - |
库存4,976 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
封装: 324-BGA |
库存3,536 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC DIGITAL SWITCH 16K CH 272BGA
|
封装: 272-BBGA |
库存7,872 |
|
- | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 272-BBGA | 272-PBGA (27x27) |
||
Microchip Technology |
IC TXRX DTMF 3V 24SSOP
|
封装: 24-SSOP (0.209", 5.30mm Width) |
库存7,008 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
封装: 32-LCC (J-Lead) |
库存5,440 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Silicon Labs |
IC PROSLIC FXS
|
封装: - |
库存6,576 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH UNIV 100V 48QFN
|
封装: 48-VFQFN Exposed Pad |
库存4,944 |
|
PCM, SPI | 1 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |