Heisener Electronics
BOM

XPC850DEZT66BUR2

3.3V|No
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MPU MPC8XX 66MHZ 256BGA

Specifications

Brand
NXP
Package
256-BGA
Packaging
—
Weight
—

Total Inventory

315pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how XPC850DEZT66BUR2 from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed66MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1)
SATA-
USBUSB 1.x (1)
Voltage - I/O3.3V
Operating Temperature0°C ~ 95°C (TA)
Security Features-
Package / Case256-BGA
Supplier Device Package256-PBGA (23x23)

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Datasheet & Documents

kmpc850dslvr50bu.pdf

PDF Document · 72 pages

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Datasheet Preview

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