Heisener Electronics
BOM

W987D2HBJX6I

1.7V ~ 1.95V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC DRAM 128M PARALLEL 90VFBGA

Specifications

Brand
Winbond Electronics
Package
90-TFBGA
Packaging
—
Weight
—

Total Inventory

274pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how W987D2HBJX6I from Winbond Electronics fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerWinbond Electronics
Series-
Memory TypeVolatile
Memory FormatDRAM
TechnologySDRAM - Mobile LPSDR
Memory Size128Mb (4M x 32)
Memory InterfaceParallel
Clock Frequency166MHz
Write Cycle Time - Word, Page15ns
Access Time5.4ns
Voltage - Supply1.7V ~ 1.95V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case90-TFBGA
Supplier Device Package90-VFBGA (8x13)

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Datasheet & Documents

w987d2hbjx7e.pdf

PDF Document · 68 pages

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