Heisener Electronics
BOM

W66AP6NBQAFJ

1.06V ~ 1.17V, 1.7V ~ 1.95V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

1GB LPDDR4, X16, 1600MHZ, -40C~1

Specifications

Brand
Winbond Electronics
Package
200-TFBGA
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how W66AP6NBQAFJ from Winbond Electronics fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerWinbond Electronics
Series-
Memory TypeVolatile
Memory FormatDRAM
TechnologySDRAM - Mobile LPDDR4
Memory Size1Gbit
Memory InterfaceLVSTL_11
Clock Frequency1.6 GHz
Write Cycle Time - Word, Page18ns
Access Time3.6 ns
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature-40°C ~ 105°C (TC)
Mounting TypeSurface Mount
Package / Case200-TFBGA
Supplier Device Package200-TFBGA (10x14.5)

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