Heisener Electronics
BOM

W63AH2NBVABI

1.14V ~ 1.3V, 1.7V ~ 1.95V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC DRAM 1GBIT HSUL 12 178VFBGA

Specifications

Brand
Winbond Electronics
Package
178-VFBGA
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how W63AH2NBVABI from Winbond Electronics fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerWinbond Electronics
Series-
Memory TypeVolatile
Memory FormatDRAM
TechnologySDRAM - Mobile LPDDR3
Memory Size1Gbit
Memory InterfaceHSUL_12
Clock Frequency800 MHz
Write Cycle Time - Word, Page15ns
Access Time5.5 ns
Voltage - Supply1.14V ~ 1.3V, 1.7V ~ 1.95V
Operating Temperature-40°C ~ 85°C (TC)
Mounting TypeSurface Mount
Package / Case178-VFBGA
Supplier Device Package178-VFBGA (11x11.5)

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