Heisener Electronics
BOM

W25Q256FVCIP

2.7V ~ 3.6V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC FLASH 256M SPI 24TFBGA

Specifications

Brand
Winbond Electronics
Package
24-TBGA
Packaging
—
Weight
—

Total Inventory

446pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how W25Q256FVCIP from Winbond Electronics fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerWinbond Electronics
SeriesSpiFlash®
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size256Mb (32M x 8)
Memory InterfaceSPI - Quad I/O, QPI
Clock Frequency104MHz
Write Cycle Time - Word, Page50µs, 3ms
Access Time-
Voltage - Supply2.7V ~ 3.6V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case24-TBGA
Supplier Device Package24-TFBGA (6x8)

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Datasheet & Documents

w25q256fveip.pdf

PDF Document · 108 pages

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