Heisener Electronics
BOM

W25Q128FVCIG

2.7V ~ 3.6V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC FLASH 128M SPI 24TFBGA

Specifications

Brand
Winbond Electronics
Package
24-TBGA
Packaging
—
Weight
—

Total Inventory

306pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how W25Q128FVCIG from Winbond Electronics fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerWinbond Electronics
SeriesSpiFlash®
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size128Mb (16M x 8)
Memory InterfaceSPI - Quad I/O, QPI
Clock Frequency104MHz
Write Cycle Time - Word, Page50µs, 3ms
Access Time-
Voltage - Supply2.7V ~ 3.6V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case24-TBGA
Supplier Device Package24-TFBGA (6x8)

Recommended Products

MFR100FRF52-174R

MFR100FRF52-174R

RES MF 1W 1% AXIAL

PHP00603E1801BBT1

PHP00603E1801BBT1

RES SMD 1.8K OHM 0.1% 3/8W 0603

CRCW25121R74FNEG

CRCW25121R74FNEG

RES SMD 1.74 OHM 1% 1W 2512

CRCW201020R5FKEF

CRCW201020R5FKEF

RES SMD 20.5 OHM 1% 3/4W 2010

0805J0630273JDR

0805J0630273JDR

CAP CER 0.027UF 63V X7R 0805

74HC594DB-112

74HC594DB-112

IC 8BIT SHIFT REGISTER 16-SSOP

DAC5578SPWR

DAC5578SPWR

IC DAC 8BIT V-OUT 16TSSOP

BFG21W-115

BFG21W-115

RF TRANS NPN 4.5V 18GHZ CMPAK-4

691412220003

691412220003

TERM BLOCK 3 POS 45DEG 7MM

HE30806T1335PN6M

HE30806T1335PN6M

HE308 22C 22#22D PIN PLUG