Heisener Electronics
BOM

VSC8224HG

3 V ~ 3.6 V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC 10/100/1000 PHY 260-HS-BGA

Specifications

Brand
Microsemi Solutions Sdn Bhd.
Package
260-BGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

6,924pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how VSC8224HG from Microsemi Solutions Sdn Bhd. fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerMicrosemi Solutions Sdn Bhd.
Series-
TypeTransceiver
ProtocolGigabit Ethernet
Number of Drivers/Receivers4/4
Duplex-
Receiver Hysteresis-
Data Rate1.25Gbps
Voltage - Supply3 V ~ 3.6 V
Operating Temperature-
Mounting TypeSurface Mount
Package / Case260-BGA Exposed Pad
Supplier Device Package256-BGA

Recommended Products

RWR82S3090FRBSL

RWR82S3090FRBSL

RES 309 OHM 1.5W 1% AXIAL

CRCW06031R80JNTA

CRCW06031R80JNTA

RES SMD 1.8 OHM 5% 1/10W 0603

3386X-1-472

3386X-1-472

TRIMMER 4.7KOHM 0.5W PC PIN SIDE

0805Y5000271KCT

0805Y5000271KCT

CAP CER 270PF 500V C0G/NP0 0805

1-1879064-6

1-1879064-6

CAP TANT 22UF 20% 6.3V 2312

B43740A5398M7

B43740A5398M7

CAP ALUM 3900UF 20% 450V SCREW

CPS16-LA00A10-SNCCWTNF-AI0CYVAR-W1010-S

CPS16-LA00A10-SNCCWTNF-AI0CYVAR-W1010-S

SWITCH PUSHBUTTON SPST 100MA 42V

5580302003F

5580302003F

LED PANEL IND YLW DIFF SNAP-IN

ZNBG3010Q16TC

ZNBG3010Q16TC

IC GENERATOR 3BIAS 2.2V 16-QSOP

RS1E350BNTB

RS1E350BNTB

MOSFET N-CH 30V 35A 8HSOP