Heisener Electronics
BOM

VSC3312XYP

2.5V|Backplane, Cable Interconnect
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC CROSSPOINT SW 12X12 196-FCBGA

Specifications

Brand
Microsemi Solutions Sdn Bhd.
Package
196-FCBGA
Packaging
—
Weight
—

Total Inventory

5,984pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how VSC3312XYP from Microsemi Solutions Sdn Bhd. fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerMicrosemi Solutions Sdn Bhd.
Series-
ApplicationsBackplane, Cable Interconnect
Multiplexer/Demultiplexer Circuit12:12
Switch Circuit-
Number of Channels1
On-State Resistance (Max)-
Voltage - Supply, Single (V+)2.5V
Voltage - Supply, Dual (V±)-
-3db Bandwidth-
Features-
Operating Temperature-
Package / Case196-FCBGA
Supplier Device Package196-FCBGA (15x15)

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