Heisener Electronics
BOM

TSI308-600CL

1.8V|HyperTransport-to-PCI Bridge
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC HYPERTRANSPORT - PCI/X 388BGA

Specifications

Brand
IDT, Integrated Device Technology
Package
388-BGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

304pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how TSI308-600CL from IDT, Integrated Device Technology fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerIDT, Integrated Device Technology Inc
SeriesTsi308™
ApplicationsHyperTransport-to-PCI Bridge
InterfacePCI
Voltage - Supply1.8V
Package / Case388-BGA Exposed Pad
Supplier Device Package388-TEPBGA (27x27)
Mounting TypeSurface Mount

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