Heisener Electronics
BOM

TC234LP32F200FACKXUMA1

3.3V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MCU 32BIT 2MB FLASH

Specifications

Brand
Infineon Technologies
Package
144-TQFP Exposed Pad
Packaging
—
Weight
—

Total Inventory

454pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how TC234LP32F200FACKXUMA1 from Infineon Technologies fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerInfineon Technologies
SeriesAURIX™
Core ProcessorTriCore™
Core Size32-Bit
Speed200MHz
ConnectivityCANbus, FlexRay, LINbus, QSPI
PeripheralsDMA, WDT
Number of I/O120
Program Memory Size2MB (2M x 8)
Program Memory TypeFLASH
EEPROM Size128K x 8
RAM Size192K x 8
Voltage - Supply (Vcc/Vdd)3.3V
Data ConvertersA/D 24x12b
Oscillator TypeExternal
Operating Temperature-40°C ~ 125°C (TA)
Mounting TypeSurface Mount
Package / Case144-TQFP Exposed Pad
Supplier Device PackagePG-TQFP-144-27

Recommended Products

NCR50SKR-52-91R

NCR50SKR-52-91R

RES 91 OHM 1/2W 10% AXIAL

AX7DBF3-614-4000T

AX7DBF3-614-4000T

XTAL OSC XO 614.4000MHZ LVDS SMD

SIT8208AC-G2-28E-37-500000Y

SIT8208AC-G2-28E-37-500000Y

MEMS OSC XO 37.5000MHZ LVCMOS LV

SIT1602BC-72-18S-66-666600D

SIT1602BC-72-18S-66-666600D

MEMS OSC XO 66.6666MHZ H/LV-CMOS

1206Y1K25P60BCT

1206Y1K25P60BCT

CAP CER 5.6PF 1.2KV C0G/NP0 1206

3001-00020287

3001-00020287

THERMOSTAT 3001 SER NON-HERMETIC

18-820-90TWR

18-820-90TWR

CONN IC DIP SOCKET 18POS TIN

89891-426HLF

89891-426HLF

CONN RCPT 52POS .100 DBL STR PCB

DWM-02-53-S-S-300

DWM-02-53-S-S-300

.050" BOARD SPACERS

BACC63BP18C8P9H

BACC63BP18C8P9H

CONN PLUG HSG MALE 8POS INLINE