Heisener Electronics
BOM

SPC5777CCK3MME3R

3V ~ 5.5V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MCU 32BIT 8MB FLASH 416MAPBGA

Specifications

Brand
NXP
Package
416-BGA
Packaging
—
Weight
—

Total Inventory

188pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how SPC5777CCK3MME3R from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesMPC57xx
Core Processore200z7
Core Size32-Bit Tri-Core
Speed264MHz
ConnectivityCANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
PeripheralsDMA, LVD, POR, Zipwire
Number of I/O-
Program Memory Size8MB (8M x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size512K x 8
Voltage - Supply (Vcc/Vdd)3V ~ 5.5V
Data ConvertersA/D 16b Sigma-Delta, eQADC
Oscillator TypeInternal
Operating Temperature-40°C ~ 125°C (TA)
Mounting TypeSurface Mount
Package / Case416-BGA
Supplier Device Package416-MAPBGA (27x27)

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Datasheet & Documents

spc5777cdk3mmo4r.pdf

PDF Document · 90 pages

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Datasheet Preview

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