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3V ~ 5.5V
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IC MCU 32BIT 4MB FLASH 416MAPBGA
Specifications
- Brand
- NXP
- Package
- 416-BGA
- Packaging
- —
- Weight
- —
Total Inventory
664pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how SPC5775EDK3MME3 from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | NXP USA Inc. | |
| Series | MPC57xx | |
| Core Processor | e200z7 | |
| Core Size | 32-Bit Dual-Core | |
| Speed | 264MHz | |
| Connectivity | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | |
| Peripherals | DMA, LVD, POR, Zipwire | |
| Number of I/O | 293 | |
| Program Memory Size | 4MB (4M x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 512K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 5.5V | |
| Data Converters | A/D 40x12b eQADCx2 | |
| Oscillator Type | External | |
| Operating Temperature | -40°C ~ 125°C (TA) | |
| Mounting Type | Surface Mount | |
| Package / Case | 416-BGA | |
| Supplier Device Package | 416-MAPBGA (27x27) |
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Datasheet & Documents
spc5775edk3mme3r.pdf
PDF Document · 81 pages
