Heisener Electronics
BOM

SPC5604BAMLL6

3V ~ 5.5V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MCU 32BIT 512KB FLASH 100LQFP

Specifications

Brand
NXP
Package
100-LQFP
Packaging
—
Weight
—

Total Inventory

367pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how SPC5604BAMLL6 from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesMPC56xx Qorivva
Core Processore200z0h
Core Size32-Bit
Speed64MHz
ConnectivityCANbus, I²C, LINbus, SCI, SPI
PeripheralsDMA, POR, PWM, WDT
Number of I/O79
Program Memory Size512KB (512K x 8)
Program Memory TypeFLASH
EEPROM Size64K x 8
RAM Size32K x 8
Voltage - Supply (Vcc/Vdd)3V ~ 5.5V
Data ConvertersA/D 28x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 125°C (TA)
Mounting TypeSurface Mount
Package / Case100-LQFP
Supplier Device Package100-LQFP (14x14)

Recommended Products

SIT9005AIL7D-XXNG

SIT9005AIL7D-XXNG

MEMS OSC PRG SSXO LVCMOS DS 2.5V

1111J6303P30DQT

1111J6303P30DQT

CAP CER 3.3PF 630V C0G/NP0 1111

PIC16F77-E-L

PIC16F77-E-L

IC MCU 8BIT 14KB FLASH 44PLCC

BZV55-C2V7-115

BZV55-C2V7-115

DIODE ZENER 2.7V 500MW SOD80C

FDS2572_1

FDS2572_1

MOSFET N-CH 150V 4.9A 8-SOIC

2027-35-CLF

2027-35-CLF

GDT 350V 15% 10KA THROUGH HOLE

HMC597LP4TR

HMC597LP4TR

RF DEMOD RFIC 4GHZ 24QFN

FHQ69273CD-518VC5

FHQ69273CD-518VC5

ANT 4G-LTE/GPS/UHF/WIFI ROOF MNT

DW-08-09-T-D-470

DW-08-09-T-D-470

.025" BOARD SPACERS

RSFJL

RSFJL

DIODE GP 600V 500MA SUB SMA

Datasheet & Documents

spc5603bf2mll4.pdf

PDF Document · 109 pages

Download

Datasheet Preview

Download