Heisener Electronics
BOM

SPC5517EAMMG66

4.5V ~ 5.25V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MCU 32BIT 1.5MB FLASH 208BGA

Specifications

Brand
NXP
Package
208-BGA
Packaging
—
Weight
—

Total Inventory

202pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how SPC5517EAMMG66 from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesMPC55xx Qorivva
Core Processore200z0, e200z1
Core Size32-Bit Dual-Core
Speed66MHz
ConnectivityCANbus, EBI/EMI, I²C, SCI, SPI
PeripheralsDMA, POR, PWM, WDT
Number of I/O144
Program Memory Size1.5MB (1.5M x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size80K x 8
Voltage - Supply (Vcc/Vdd)4.5V ~ 5.25V
Data ConvertersA/D 40x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 125°C (TA)
Mounting TypeSurface Mount
Package / Case208-BGA
Supplier Device Package208-MAPBGA (17x17)

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Datasheet & Documents

spc5517gammg66.pdf

PDF Document · 22 pages

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