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SIP1X27-014BLF

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Part Number

SIP1X27-014BLF

Manufacturer

Amphenol FCI

Description

CONN SOCKET SIP 27POS TIN

Lifecycle

Obsolete

RoHS

No RoHS Information

EDA/CAD Models

SIP1X27-014BLF PCB Footprint and Symbol

Warehouses

USA, Europe, China, Hong Kong SAR

Estimated Delivery

Sep 28 - Oct 3 (Choose Expedited Shipping)

Warranty

Up to 1 year [Limitety]*

1
In Stock:7146 pcs

运送服务:

SIP1X27-014BLF 规格

Contact Finish - Mating
Amphenol FCI
Contact Finish - Post
SIP1x
Contact Finish Thickness - Mating
SIP
Contact Finish Thickness - Post
27 (1 x 27)
Contact Material - Mating
0.100" (2.54mm)
Contact Material - Post
Tin
Features
150µin (3.81µm)
Housing Material
Beryllium Copper
Manufacturer
Through Hole
Mounting Type
Closed Frame
Number of Positions or Pins (Grid)
Solder
Operating Temperature
0.100" (2.54mm)
Pitch - Mating
Tin
Pitch - Post
200µin (5.08µm)
Series
Brass
Termination
Polyphenylene Sulfide (PPS), Glass Filled
Type
-

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