Heisener Electronics
BOM

PCX755BVZFU300LE

2.5V, 3.3V|No
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MPU POWERPC 300MHZ 360BGA

Specifications

Brand
Microchip Technology
Package
360-BBGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

337pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how PCX755BVZFU300LE from Microchip Technology fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerMicrochip Technology
Series-
Core ProcessorPowerPC
Number of Cores/Bus Width1 Core, 32-Bit
Speed300MHz
Co-Processors/DSP-
RAM Controllers-
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet-
SATA-
USB-
Voltage - I/O2.5V, 3.3V
Operating Temperature-40°C ~ 110°C (TJ)
Security Features-
Package / Case360-BBGA Exposed Pad
Supplier Device Package360-PBGA (25x25)

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Datasheet & Documents

pcx755cvzfu400le.pdf

PDF Document · 56 pages

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Datasheet Preview

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