Heisener Electronics
BOM

MSCSM170DUM23T3AG

1700V (1.7kV)|124A (Tc)|602W (Tc)
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

SIC 2N-CH 1700V 124A SP3F

Specifications

Brand
Microchip Technology
Package
Module
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how MSCSM170DUM23T3AG from Microchip Technology fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

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Technical Specifications

ManufacturerMicrochip Technology
Series-
FET TypeSilicon Carbide (SiC)
FET Feature-
Drain to Source Voltage (Vdss)1700V (1.7kV)
Current - Continuous Drain (Id) @ 25°C124A (Tc)
Rds On (Max) @ Id, Vgs22.5mOhm @ 60A, 20V
Vgs(th) (Max) @ Id3.2V @ 5mA
Gate Charge (Qg) (Max) @ Vgs356nC @ 20V
Input Capacitance (Ciss) (Max) @ Vds6600pF @ 1000V
Power - Max602W (Tc)
Operating Temperature-40°C ~ 175°C (TJ)
Mounting TypeChassis Mount
Package / CaseModule
Supplier Device PackageSP3F

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