Heisener Electronics
BOM

MPC860DECVR66D4

3.3V|No
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MPU MPC8XX 66MHZ 357BGA

Specifications

Brand
NXP
Package
357-BBGA
Packaging
—
Weight
—

Total Inventory

373pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how MPC860DECVR66D4 from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed66MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (2)
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature-40°C ~ 95°C (TA)
Security Features-
Package / Case357-BBGA
Supplier Device Package357-PBGA (25x25)

Recommended Products

TNPW201010K5BEEY

TNPW201010K5BEEY

RES 10.5K OHM 0.1% 2/5W 2010

RG1005P-1330-B-T5

RG1005P-1330-B-T5

RES SMD 133 OHM 0.1% 1/16W 0402

3635B1R8PT

3635B1R8PT

FIXED IND 1.8UH 20A 3.4 MOHM SMD

AMPMDDD-4-9152

AMPMDDD-4-9152

MEMS OSC XO 4.9152MHZ CMOS SMD

ECQ-V1333JMW

ECQ-V1333JMW

CAP FILM 0.033UF 5% 100VDC RAD

LC4256C-75TN176C

LC4256C-75TN176C

IC CPLD 256MC 7.5NS 176TQFP

NE5550979A-A

NE5550979A-A

FET RF 30V 900MHZ 79A-PKG

SFAS805GHMNG_1

SFAS805GHMNG_1

DIODE GEN PURP 300V 8A TO263AB

5430483

5430483

TERM BLOCK HDR 8POS 90DEG 3.5MM

MS27473T22B55P

MS27473T22B55P

8T 55C 55#20 PLUG

Datasheet & Documents

mpc860srzq66d4r2.pdf

PDF Document · 77 pages

Download

Datasheet Preview

Download