Heisener Electronics
BOM

MPC850DECZQ66BU

3.3V|No
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MPU MPC8XX 66MHZ 256BGA

Specifications

Brand
NXP
Package
256-BBGA
Packaging
—
Weight
—

Total Inventory

126pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how MPC850DECZQ66BU from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed66MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1)
SATA-
USBUSB 1.x (1)
Voltage - I/O3.3V
Operating Temperature-40°C ~ 95°C (TA)
Security Features-
Package / Case256-BBGA
Supplier Device Package256-PBGA (23x23)

Recommended Products

570BAB001637DGR

570BAB001637DGR

XTAL OSC XO 156.2500MHZ LVDS SMD

SIT1602BC-32-33N-27-000000X

SIT1602BC-32-33N-27-000000X

MEMS OSC XO 27.0000MHZ H/LV-CMOS

SIT9005AIA7G-30DE

SIT9005AIA7G-30DE

MEMS OSC PROG SSXO LVCMOS DS 3V

1812J6300100GAR

1812J6300100GAR

CAP CER 10PF 630V C0G/NP0 1812

10AX032H4F34I3LG

10AX032H4F34I3LG

IC FPGA 384 I/O 1152FBGA

MB91F525KHBPMC-GS-F4E1

MB91F525KHBPMC-GS-F4E1

IC MCU 32BIT 832KB FLASH 144LQFP

T360N28TOFXPSA1

T360N28TOFXPSA1

SCR MODULE 2800V 550A DO200AA

FTSH-112-02-L-DV-P-TR

FTSH-112-02-L-DV-P-TR

.050'' X .050 TERMINAL STRIP

D38999-24ZD5SB-LC

D38999-24ZD5SB-LC

CONN RCPT HSNG FMALE 5POS PNL MT

RMC08DRYN-S13

RMC08DRYN-S13

CONN EDGE DUAL FMALE 16POS 0.100

Datasheet & Documents

kmpc850dslvr50bu.pdf

PDF Document · 72 pages

Download

Datasheet Preview

Download