Heisener Electronics
BOM

MPC8358EZQADDDA

1.8V, 2.5V, 3.3V|No
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MPU MPC83XX 266MHZ 668BGA

Specifications

Brand
NXP
Package
668-BBGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

279pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how MPC8358EZQADDDA from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesMPC83xx
Core ProcessorPowerPC e300
Number of Cores/Bus Width1 Core, 32-Bit
Speed266MHz
Co-Processors/DSPCommunications; QUICC Engine, Security; SEC
RAM ControllersDDR, DDR2
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10/100/1000Mbps (1)
SATA-
USBUSB 1.x (1)
Voltage - I/O1.8V, 2.5V, 3.3V
Operating Temperature0°C ~ 105°C (TA)
Security FeaturesCryptography, Random Number Generator
Package / Case668-BBGA Exposed Pad
Supplier Device Package668-PBGA-PGE (29x29)

Recommended Products

RNC60J5603BSB14

RNC60J5603BSB14

RES 560K OHM 1/4W .1% AXIAL

9T08052A7691CAHFT

9T08052A7691CAHFT

RES SMD 7.69KOHM 0.25% 1/8W 0805

QYX1H392KTP

QYX1H392KTP

CAP FILM 3900PF 10% 50VDC RADIAL

VE-J10-MW-F4

VE-J10-MW-F4

DC DC CONVERTER 5V 100W

S29GL128S90DHSS33

S29GL128S90DHSS33

IC FLASH 128M PARALLEL 64BGA

LM385BD-2-5G

LM385BD-2-5G

IC VREF SHUNT 2.5V 8SOIC

CDLL967B

CDLL967B

DIODE ZENER 18V 500MW DO213AB

FHP-23-01-TM-S

FHP-23-01-TM-S

.156 HI POWER SOCKET ASSEMBLY

10-89-1121

10-89-1121

CONN HEADER 12POS .100 VERT GOLD

JT07RE16-6P-023

JT07RE16-6P-023

JT 6C 6#12 PIN RECP

Datasheet & Documents

mpc8358zqagdga.pdf

PDF Document · 95 pages

Download

Datasheet Preview

Download