Heisener Electronics
BOM

MPC8313EVRAGDC

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IC MPU POWERQUICC II PRO 516PBGA

Specifications

Brand
NXP
Package
516-BBGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

292pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how MPC8313EVRAGDC from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
Series*
Core Processor-
Number of Cores/Bus Width-
Speed-
Co-Processors/DSP-
RAM Controllers-
Graphics Acceleration-
Display & Interface Controllers-
Ethernet-
SATA-
USB-
Voltage - I/O-
Operating Temperature-
Security Features-
Package / Case516-BBGA Exposed Pad
Supplier Device Package516-TEPBGA (27x27)

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Datasheet & Documents

mpc8313zqaffb.pdf

PDF Document · 99 pages

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Datasheet Preview

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