Heisener Electronics
BOM

MC33PF8200CLES

2.5V ~ 5.5V|-
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC POWER MANAGEMENT

Specifications

Brand
NXP
Package
56-VFQFN Exposed Pad
Packaging
—
Weight
—

Total Inventory

199pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how MC33PF8200CLES from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
Series-
ApplicationsHigh Performance i.MX 8, S32x Processor Based
Current - Supply-
Voltage - Supply2.5V ~ 5.5V
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount, Wettable Flank
Package / Case56-VFQFN Exposed Pad
Supplier Device Package56-HVQFN (8x8)

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Datasheet & Documents

mc33pf8200dges.pdf

PDF Document · 2 pages

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Datasheet Preview

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