Heisener Electronics
BOM

M2S050-FGG896I

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IC SOC CORTEX-M3 166MHZ 896FBGA

Specifications

Brand
Microsemi
Package
896-BGA
Packaging
—
Weight
—

Total Inventory

216pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how M2S050-FGG896I from Microsemi fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerMicrosemi Corporation
SeriesSmartFusion®2
ArchitectureMCU, FPGA
Core ProcessorARM® Cortex®-M3
Flash Size256KB
RAM Size64KB
PeripheralsDDR, PCIe, SERDES
ConnectivityCANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed166MHz
Primary AttributesFPGA - 50K Logic Modules
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case896-BGA
Supplier Device Package896-FBGA (31x31)

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