Heisener Electronics
BOM

M2S010T-1FGG484M

OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC SOC CORTEX-M3 166MHZ 484FBGA

Specifications

Brand
Microsemi
Package
484-BGA
Packaging
—
Weight
—

Total Inventory

323pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how M2S010T-1FGG484M from Microsemi fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerMicrosemi Corporation
SeriesSmartFusion®2
ArchitectureMCU, FPGA
Core ProcessorARM® Cortex®-M3
Flash Size256KB
RAM Size64KB
PeripheralsDDR, PCIe, SERDES
ConnectivityCANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed166MHz
Primary AttributesFPGA - 10K Logic Modules
Operating Temperature-55°C ~ 125°C (TJ)
Package / Case484-BGA
Supplier Device Package484-FPBGA (23x23)

Recommended Products

RN73H1ETTP82R0B25

RN73H1ETTP82R0B25

RES THIN FILM SMD

SIT8209AI-G1-33S-133-333000X

SIT8209AI-G1-33S-133-333000X

MEMS OSC XO 133.3330MHZ LVCMOS

SG5032CAN-64-000000M-TJGA3

SG5032CAN-64-000000M-TJGA3

XTAL OSC XO 64.0000MHZ CMOS SMD

E36D100LPN502UA54M

E36D100LPN502UA54M

CAP ALUM 5000UF 10V SCREW

P51-2000-A-G-M12-4-5OVP-000-000

P51-2000-A-G-M12-4-5OVP-000-000

SENSOR 2000PSI 1/8-27NPT .5-4.5V

HSLCS-CALCL-003

HSLCS-CALCL-003

ROUND HEAT SINK XICATO XSM

MAX5814AUD

MAX5814AUD

IC DAC 10BIT V-OUT 14TSSOP

Z0110MN-5AA4

Z0110MN-5AA4

TRIAC 600V 1A SOT223

TVP00RQS-19-18S

TVP00RQS-19-18S

CONN RCPT FMALE 18POS GOLD CRIMP

AMC65DREH

AMC65DREH

CONN EDGE DUAL FMALE 130POS .100