Heisener Electronics
BOM

LS1024ASE7MLA

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IC PROCESSOR DUAL CORE 625BGA

Specifications

Brand
NXP
Package
625-BFBGA, FCBGA
Packaging
—
Weight
—

Total Inventory

276pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how LS1024ASE7MLA from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesQorIQ® Layerscape
Core ProcessorARM® Cortex®-A9
Number of Cores/Bus Width2 Core, 32-Bit
Speed1.2GHz
Co-Processors/DSP-
RAM ControllersDDR3
Graphics Acceleration-
Display & Interface Controllers-
EthernetGbE (3)
SATASATA 3Gbps (2)
USBUSB 2.0 + PHY (1), USB 3.0 + PHY
Voltage - I/O-
Operating Temperature0°C ~ 70°C (TA)
Security FeaturesSecure Boot, TrustZone®
Package / Case625-BFBGA, FCBGA
Supplier Device Package625-FCPBGA (21x21)

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Datasheet & Documents

ls1024ase7ela.pdf

PDF Document · 2 pages

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