Heisener Electronics
BOM

LS1024ASE7ELA

-|-
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC PROCESSOR DUAL CORE

Specifications

Brand
NXP
Package
625-BFBGA, FCBGA
Packaging
—
Weight
—

Total Inventory

390pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how LS1024ASE7ELA from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesQorIQ® Layerscape
Core ProcessorARM® Cortex®-A9
Number of Cores/Bus Width2 Core, 32-Bit
Speed1.2GHz
Co-Processors/DSP-
RAM ControllersDDR3
Graphics Acceleration-
Display & Interface Controllers-
EthernetGbE (3)
SATASATA 3Gbps (2)
USBUSB 2.0 + PHY (1), USB 3.0 + PHY
Voltage - I/O-
Operating Temperature0°C ~ 70°C (TA)
Security FeaturesSecure Boot, TrustZone®
Package / Case625-BFBGA, FCBGA
Supplier Device Package625-FCPBGA (21x21)

Recommended Products

RN73H1ETTP4121B10

RN73H1ETTP4121B10

RES THIN FILM SMD

SIT1602BC-81-XXE-62-500000T

SIT1602BC-81-XXE-62-500000T

MEMS OSC XO 62.5000MHZ H/LV-CMOS

K153Z10Y5VF5TL2

K153Z10Y5VF5TL2

CAP CER 0.015UF 50V Y5V RADIAL

BZ-2RL-A2

BZ-2RL-A2

SWITCH SNAP ACTION SPDT 15A 125V

P31-1XA-MHIA

P31-1XA-MHIA

AC-DC POWER MODULE +/- 15VDC OUT

XC6501D431GR-G

XC6501D431GR-G

CL CAPLESS 200MA HIGH SPEED LDO

SIDC09D60F6

SIDC09D60F6

DIODE GEN PURP 600V 30A WAFER

CES-147-01-G-S

CES-147-01-G-S

LOW PROFILE .025" SQUARE STRIPS

DA-U15P

DA-U15P

CONN D-SUB PLUG 15POS STR CRIMP

PNE20010ER-QX

PNE20010ER-QX

HYPERFAST/ULTRAFAST RECOVERY REC

Datasheet & Documents

ls1024ase7ela.pdf

PDF Document · 2 pages

Download

Datasheet Preview

Download