Heisener Electronics
BOM

LS101MAXE7DFA

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OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC PROCESSOR DUAL CORE

Specifications

Brand
NXP
Package
448-FBGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

210pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how LS101MAXE7DFA from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesQorlQ LS1
Core ProcessorARM1136JF-S
Number of Cores/Bus Width1 Core, 32-Bit
Speed650MHz
Co-Processors/DSP-
RAM ControllersDDR2
Graphics AccelerationNo
Display & Interface Controllers-
EthernetGbE (2)
SATA-
USBUSB 2.0 + PHY (1)
Voltage - I/O-
Operating Temperature-40°C ~ 85°C (TA)
Security Features-
Package / Case448-FBGA Exposed Pad
Supplier Device Package448-PBGA w/Heat Spreader (23x23)

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