Heisener Electronics
BOM

LPC55S16JBD100K

1.8V ~ 3.6V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MCU 32BIT 256KB FLSH 100LQFP

Specifications

Brand
NXP
Package
100-LQFP Exposed Pad
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how LPC55S16JBD100K from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP
SeriesLPC55S1x
Core ProcessorARM® Cortex®-M33
Core Size32-Bit Single-Core
Speed150MHz
ConnectivityCAN FD, Flexcomm, I2C, SPI, UART/USART, USB
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O64
Program Memory Size256KB (256K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size96K x 8
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V
Data ConvertersA/D 10x16b SAR
Oscillator TypeExternal, Internal
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case100-LQFP Exposed Pad
Supplier Device Package100-HLQFP (14x14)

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