Heisener Electronics
BOM

KMPC859TZP133A

3.3V|No
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC MPU MPC8XX 133MHZ 357BGA

Specifications

Brand
NXP
Package
357-BBGA
Packaging
—
Weight
—

Total Inventory

446pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how KMPC859TZP133A from NXP fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed133MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1), 10/100Mbps (1)
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature0°C ~ 95°C (TA)
Security Features-
Package / Case357-BBGA
Supplier Device Package357-PBGA (25x25)

Recommended Products

RNX0253M00FNLB

RNX0253M00FNLB

RES 3M OHM 1% 1/2W AXIAL

RN65D4753FBSL

RN65D4753FBSL

RES 475K OHM 1/2W 1% AXIAL

KNP1WSJR-52-0R27

KNP1WSJR-52-0R27

RES 0.27 OHM 1W 5% AXIAL

SIT1602BI-13-33N-66-666660E

SIT1602BI-13-33N-66-666660E

MEMS OSC XO 66.66666MHZ H/LVCMOS

SIT5156AI-F533JQ

SIT5156AI-F533JQ

OSC PROGRAMMABLE DCTCXO

SST-50-W30M-F21-F3700

SST-50-W30M-F21-F3700

BIG CHIP LED HB MODULE WHITE

LCMXO2-4000HC-5BG332C

LCMXO2-4000HC-5BG332C

IC FPGA 274 I/O 332CABGA

2010223024

2010223024

SLIM-GRID HEADER, 24 CIRCUITS, T

FCC17B25SE210

FCC17B25SE210

CONN D-SUB RCPT 25POS VERT SLDR

MS3106E12S-3SW

MS3106E12S-3SW

CONN PLUG 2POS INLINE W/SKTS

Datasheet & Documents

kmpc866tzp133a.pdf

PDF Document · 96 pages

Download

Datasheet Preview

Download