Heisener Electronics
BOM

IC-628-SGG

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 28POS GOLD

Specifications

Brand
Samtec Inc.
Package
—
Packaging
—
Weight
—

Total Inventory

5,328pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how IC-628-SGG from Samtec Inc. fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesPhosphor Bronze
Type-55°C ~ 125°C
Number of Positions or Pins (Grid)Solder
Pitch - MatingGold
Contact Finish - MatingSamtec Inc.
Contact Finish Thickness - MatingDIP, 0.6" (15.24mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeOpen Frame
Features30µin (0.76µm)
TerminationPolyester, Glass Filled
Pitch - Post30µin (0.76µm)
Contact Finish - PostIC
Contact Finish Thickness - Post28 (2 x 14)
Contact Material - PostGold
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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