Heisener Electronics
BOM

HDG200-DN-3

44-TQFN, Exposed Pad|H&D Wireless AB|1kB EEPROM, 160kB SRAM
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

WIFI SIP 802.11 BGN 44QFN

Specifications

Brand
H&D Wireless AB
Package
-
Packaging
—
Weight
—

Total Inventory

5,364pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how HDG200-DN-3 from H&D Wireless AB fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

Manufacturer-
Series197mA
Type-40°C ~ 85°C
RF Family/Standard-
ProtocolSDIO, SPI
Modulation72.2Mbps
FrequencyWiFi
Data Rate (Max)TxRx + MCU
Power - Output1kB EEPROM, 160kB SRAM
Sensitivity2.75 V ~ 3.6 V
Memory Size2.4GHz
Serial Interfaces49mA
GPIO802.11b/g/n
Voltage - Supply44-TQFN, Exposed Pad
Current - ReceivingH&D Wireless AB
Current - Transmitting-
Operating Temperature17dBm
Package / Case-

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