Heisener Electronics
BOM

EP2AGX45DF25I3G

0.87V ~ 0.93V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC FPGA 252 I/O 572FBGA

Specifications

Brand
Intel
Package
572-BGA, FCBGA
Packaging
—
Weight
—

Total Inventory

438pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how EP2AGX45DF25I3G from Intel fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerIntel
SeriesArria II GX
Number of LABs/CLBs1805
Number of Logic Elements/Cells42959
Total RAM Bits3517440
Number of I/O252
Number of Gates-
Voltage - Supply0.87V ~ 0.93V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case572-BGA, FCBGA
Supplier Device Package572-FBGA, FC (25x25)

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