Heisener Electronics
BOM

ED32DT

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 32POS TIN

Specifications

Brand
On Shore Technology Inc.
Package
—
Packaging
—
Weight
—

Total Inventory

25,590pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how ED32DT from On Shore Technology Inc. fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesPhosphor Bronze
Type-55°C ~ 110°C
Number of Positions or Pins (Grid)Solder
Pitch - MatingTin
Contact Finish - MatingOn Shore Technology Inc.
Contact Finish Thickness - MatingDIP, 0.6" (15.24mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeOpen Frame
Features60µin (1.52µm)
TerminationPolybutylene Terephthalate (PBT), Glass Filled
Pitch - Post60µin (1.52µm)
Contact Finish - PostED
Contact Finish Thickness - Post32 (2 x 16)
Contact Material - PostTin
Housing MaterialPhosphor Bronze
Operating Temperature0.100" (2.54mm)

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