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DRA755BMGABCRQ1

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Part Number

DRA755BMGABCRQ1

Manufacturer

Texas Instruments

Description

PROTOTYPE

Lifecycle

Active

RoHS

No RoHS Information

EDA/CAD Models

DRA755BMGABCRQ1 PCB Footprint and Symbol

Warehouses

USA, Europe, China, Hong Kong SAR

Estimated Delivery

Sep 28 - Oct 3 (Choose Expedited Shipping)

Warranty

Up to 1 year [Limitety]*

1
In Stock:0 pcs

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DRA755BMGABCRQ1 规格

Clock Rate
-
Interface
CANbus, I2C, McASP, SPI, UART
Manufacturer
Texas Instruments
Mounting Type
Surface Mount
Non-Volatile Memory
ROM (256kB)
On-Chip RAM
2.5MB
Operating Temperature
-40°C ~ 125°C (TJ)
Package / Case
760-BFBGA, FCBGA
Series
DRA74x
Supplier Device Package
760-FCBGA (23x23)
Type
Floating Point
Voltage - Core
1.15V
Voltage - I/O
1.35V, 1.8V, 3.3V

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