Heisener Electronics
BOM

DPF308-998Z

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 8POS TIN-LEAD

Specifications

Brand
Amphenol FCI
Package
—
Packaging
—
Weight
—

Total Inventory

2,322pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how DPF308-998Z from Amphenol FCI fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesBrass
Type-
Number of Positions or Pins (Grid)Solder
Pitch - MatingTin-Lead
Contact Finish - MatingAmphenol FCI
Contact Finish Thickness - MatingDIP, 0.3" (7.62mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeOpen Frame
Features200µin (5.08µm)
TerminationPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Post200µin (5.08µm)
Contact Finish - PostDPF3
Contact Finish Thickness - Post8 (2 x 4)
Contact Material - PostTin-Lead
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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