Heisener Electronics
BOM

DLP5532AFYSQ1

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IC DIG MICROMIRROR DEV 149CPGA

Specifications

Brand
Texas Instruments
Package
149-BFCPGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how DLP5532AFYSQ1 from Texas Instruments fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
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Technical Specifications

ManufacturerTexas Instruments
Series-
TypeDigital Micromirror Device (DMD)
Applications-
Mounting TypeThrough Hole
Package / Case149-BFCPGA Exposed Pad
Supplier Device Package149-CPGA (22.3x32.2)

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